MARC details
| 000 -LÍDER |
|---|
| fixed length control field |
01108cam a2200313 a 4500 |
| 001 - NÚMERO DE CONTROL |
|---|
| control field |
u323914 |
| 003 - IDENTIFICADOR DEL NÚMERO DE CONTROL |
|---|
| control field |
SIRSI |
| 005 - FECHA Y HORA DE LA ULTIMA TRANSACCIÓN |
|---|
| control field |
20160812064837.0 |
| 008 - ELEMENTOS DE LONGITUD FIJA -- INFORMACIÓN GENERAL |
|---|
| fixed length control field |
101124s2004 gw a gr 001 0 eng c |
| 020 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA LIBROS |
|---|
| International Standard Book Number |
3540210490 |
| 022 ## - NÚMERO INTERNACIONAL NORMALIZADO PARA PUBLICACIONES SERIADAS |
|---|
| International Standard Serial Number |
0933033X |
| 040 ## - FUENTE DE CATALOGACIÓN |
|---|
| Original cataloging agency |
DLC |
| Transcribing agency |
DLC |
| Modifying agency |
DLC |
| 050 #0 - SIGNATURA TOPOGRÁFICA DE LA BIBLIOTECA DEL CONGRESO |
|---|
| Classification number |
TK7871.85 |
| Item number |
W33 2004 |
| 245 00 - MENCIÓN DE TITULO |
|---|
| Title |
Wafer bonding : |
| Remainder of title |
applications and technology / |
| Statement of responsibility, etc. |
M. Alexe, U. Gösele (eds.). |
| 260 ## - PUBLICACIÓN, DISTRIBUCIÓN, ETC. (PIE DE IMPRENTA) |
|---|
| Place of publication, distribution, etc. |
Berlin : |
| Name of publisher, distributor, etc. |
Springer, |
| Date of publication, distribution, etc. |
2004. |
| 300 ## - DESCRIPCIÓN FÍSICA |
|---|
| Extent |
xv, 499 p. : |
| Other physical details |
il. ; |
| Dimensions |
24 cm. |
| 490 0# - MENCIÓN DE SERIE |
|---|
| Series statement |
Springer series in materials science ; |
| Volume/sequential designation |
75 |
| 504 ## - NOTA DE BIBLIOGRAFÍA, ETC. |
|---|
| Bibliography, etc |
Incluye referencias bibliográficas e índice. |
| 596 ## - |
|---|
| -- |
2 |
| 650 #7 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Semiconductores |
| General subdivision |
Unión. |
| Relator term |
lemb |
| 650 #7 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Semiconductores |
| General subdivision |
Oblea (Electrónica). |
| Source of heading or term |
lemb |
| 650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Semiconductors |
| General subdivision |
Bonding. |
| 650 #0 - ASIENTO SECUNDARIO DE MATERIA - TERMINO TEMÁTICO |
|---|
| Topical term or geographic name as entry element |
Semiconductor wafers. |
| 700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL |
|---|
| Personal name |
Alexe, M. |
| Fuller form of name |
(Marin), |
| Relator term |
ed. |
| 700 1# - ASIENTO SECUNDARIO - NOMBRE PERSONAL |
|---|
| Personal name |
Gösele, U., |
| Relator term |
ed. |
| 856 42 - LOCALIZACIÓN Y ACCESO ELECTRÓNICOS |
|---|
| Materials specified |
Publisher description |
| Uniform Resource Identifier |
<a href="http://www.loc.gov/catdir/enhancements/fy0817/2004046626-d.html">http://www.loc.gov/catdir/enhancements/fy0817/2004046626-d.html</a> |
| 856 41 - LOCALIZACIÓN Y ACCESO ELECTRÓNICOS |
|---|
| Materials specified |
Table of contents only |
| Uniform Resource Identifier |
<a href="http://www.loc.gov/catdir/enhancements/fy0817/2004046626-t.html">http://www.loc.gov/catdir/enhancements/fy0817/2004046626-t.html</a> |
| 942 ## - TIPO DE MATERIAL (KOHA) |
|---|
| Koha item type |
Reserva absoluta |
